DFI
SO630
ATX, AMD® EPYC 3000 Series, 8 DDR4 RDIMM/UDIMM, 3 PCIe x16 (up to 6 PCIe x8), 1 PCI, 1 M.2 M Key
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- Rich I/O: 2 COM, 8 USB 3.1 Gen1
- 8 DDR4 RDIMM/UDIMM up to 256GB
- Expansion: 3 PCIe x16 (up to 6 PCIe x8), 1 PCI, 1 M.2 M Key (PCIe x4 NVMe), 1 M.2 M Key (SATA/PCIe x2 NVMe)
- 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
System
Processor
AMD® EPYC™ Embedded 3451, 16 Core, 32 Threads, 2.14GHz (3GHz), 80-100W
AMD® EPYC™ Embedded 3351, 12 Core, 24 Threads, 1.9GHz (3GHz), 60-80W
AMD® EPYC™ Embedded 3351, 12 Core, 24 Threads, 1.9GHz (3GHz), 60-80W
Memory
8 DDR4 RDIMM/UDIMM up to 256GB
BIOS
Insyde
Expansion
Interface
3 x PCIe x16 (up to 6 PCIe x8)
1 x PCI
1 x M.2 M Key (PCIe x4 NVMe)
1 x M.2 M Key (SATA/PCIe x2 NVMe)
1 x PCI
1 x M.2 M Key (PCIe x4 NVMe)
1 x M.2 M Key (SATA/PCIe x2 NVMe)
Ethernet
Controller
2 x Intel i210AT
Rear I/O
Ethernet
2 x GbE (RJ-45)
Serial
1 x RS-232/422/485 (DB-9)
1 x RS-232 (DB-9)
1 x RS-232 (DB-9)
USB
6 x USB 3.1 Gen1
Internal I/O
USB
2 x USB 3.1 Gen1
SATA
3 x SATA 3.0
2 x SATA 3.0 support RAID 0/1
2 x SATA 3.0 support RAID 0/1
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
TPM2.0 (opt.)
Power
Type
ATX power input
Consumption
TBD
Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows 10
Windows Server 2019
Windows Server 2019
Linux
Linux
Environment
Temperature
Operating: -5 to 65°C Storage: -40 to 85°C
Humidity
Operating: 10 to 90% RH Storage: 10 to 90% RH
MTBF
TBD
Mechanism
Dimensions
ATX Form Factor 305mm x 244mm
Packing List
Packing List
1 SO630 motherboard
1 I/O shield TBD
1 Cooler TBD
1 I/O shield TBD
1 Cooler TBD
Country of Origin
Country of Origin
Taiwan
Extra documentatie
